July 16, 2007 - Frontline announces the release of InPlan 2.20
Frontline PCB Solutions announces the release of version 2.20 of its InPlanTM engineering system on July 16, 2007.
InPlanTM 2.20 delivers new flex and rigid-flex engineering capabilities including support for flex materials and multi-zone buildups, spanless drilling and routing, interface with GenFlexTM, a dedicated Materials Tooling Manager, and manual stackup for flex and rigid-flex board designs.
In addition, InPlanTM 2.20 introduces advanced ECN management software for defining, approving, and distributing engineering change notices and an electronic verification tool to replace the hard copy checklists commonly used at different stages in the job cycle.
Other key features in this version include new impedance models, block optimization in panel design for increased accuracy in HDI design imaging, stackup image configuration, and material name control.
See: Support Latest Version section for a full list of new features and enhancements. | 
